氮化硼
材料科学
纳米片
热导率
复合材料
复合数
纺纱
导电体
热阻
氮化物
硼
数码产品
热的
纳米技术
图层(电子)
电气工程
化学
有机化学
工程类
物理
气象学
作者
Jiajing Zhang,P Zhang,Chunhua Zhang,Jiahao Xu,Leyan Zhang,Liangjun Xia
标识
DOI:10.3390/ijms252011156
摘要
With the innovation of modern electronics, heat dissipation in the devices faces several problems. In our work, boron nitride (BN) with good thermal conductivity (TC) was successfully fabricated by constructing the BN along the axial direction and the surface-grafted BN hybrid composite fibers via the wet-spinning and hot-pressing method. The unique inter-outer and inter-interconnected hybrid structure of composite fibers exhibited 176.47% thermal conductivity enhancement (TCE), which exhibits good TC, mechanical resistance, and chemical resistance. In addition, depending on the special structure of the composite fibers, it provides a new strategy for fabricating thermal interface materials in the electronic device.
科研通智能强力驱动
Strongly Powered by AbleSci AI