Brief Review of Nanosilver Sintering: Manufacturing and Reliability

In this review, the present status of nanosilver sintering is adapted in detail. This review shows the current scholarly exploration and achievements in this field through the two aspects of manufacturing and reliability. The preparation of nanosilver particles, organic coating and sintering methods, microstructure and failure modules of sintered nanosilver layers are described in detail. Finally, prospects and dilemmas of nanosilver sintering technology as a connection material for semiconductor devices and the directions of future extensions are discussed.