聚酰亚胺
材料科学
BPDA公司
电介质
邻苯二甲酸酐
玻璃化转变
二胺
高分子化学
热塑性塑料
介电损耗
共聚物
乙醚
三氟甲基
复合材料
溶解度
氟
化学工程
有机化学
聚合物
化学
冶金
图层(电子)
烷基
催化作用
工程类
光电子学
作者
Lu Zhao,Xiangjun Ma,Qilong Huang,Chonghao Lu,Xianwu Cao
标识
DOI:10.1177/09540083221094963
摘要
Novel fluorine-containing polyimides were synthesized through copolymerization by using 2,3,3′,4′-biphenyltetracarboxylic dianhydride (α-BPDA) and 4,4′-(4,4′-isopropydenediphenox-y) bis-(phthalic anhydride) (BPADA) as dianhydrides and 4,4′-oxydianiline (ODA) and 2,2 - Bis [4-(4-aminophenoxy)phenyl]-hexafluoropropanane (HFBAPP) as diamines. Noncoplanar structure, flexible ether bond, and trifluoromethyl give the polyimide good thermoplastic, solubility, and heat resistance. The glass transition temperatures of polyimide films are 232.5°C∼262.2°C, the 5% weight loss temperatures are 521.5°C∼531.0°C, and the residual mass is more than 50% as heating to 800°C. With the increase of HFBAPP content in diamine, the dielectric constant of the material decreases from 3.21 to 2.78, and the dielectric loss decreases from 0.00962 to 0.00687 at 1 MHz, which greatly improves the dielectric properties of the material.
科研通智能强力驱动
Strongly Powered by AbleSci AI