集成电路封装
高分辨率
电子包装
管(容器)
计算机科学
工程类
集成电路
机械工程
电气工程
地质学
遥感
作者
Holger R. Roth,Zhenhui He,Thomas Paul
标识
DOI:10.1109/ipfa.2008.4588179
摘要
Nanofocus tube technology in combination with high resolution CT are the driving forces in X-ray and the leading future technologies for the inspection of IC packages. The paper shows different results of highest resolution failure analysis performed with latest 2D and 3D nanofocus techniques like the first 180 kV nanoCT system.
科研通智能强力驱动
Strongly Powered by AbleSci AI