Comparison of effects of simulated electric field interference and presence of a barrier in the nickel electroplating process to experimental data

Nickel coatings were electroplated galvanostatically under electric field interference condition and also under the presence of two different types and sizes of barriers in the electroplating bath. The electric field interference and the presence of a barrier during electroplating were simulated using COMSOL® software in order to investigate the effect of these phenomena on the coatings’ characteristics. Effect of electric field interference and the presence of a barrier on the coatings’ thickness, electric field lines and simulated potential of the electroplating process were also examined. The results showed that the coating thickness was decreased with electric field interference and the presence of a barrier. Various types of barriers, with differing electrical conductivities, had different effects on the coatings’ characteristics. Finally, simulation of these two processes showed that electric field interference can bend the electric field lines and change the coating thickness. Moreover, the presence of barriers can either disrupt or strengthen the electric field, depending on their electrical conductivities.