Thermoplastic-based microfluidic chip bonding with PES hot melt adhesive film

In this study, a low-cost and rapid bonding method for thermoplastic-based microfluidic devices is introduced. The thermoplastic substrate and cover plate were directly bonded with PES copolyester hot melt adhesive film. Compared with conventional bonding methods for thermoplastic chips, e.g. thermal fusion and chemical-assisted bonding, the proposed bonding process can be finished within minutes without sophisticated instruments or volatile chemical solvents. Several microfluidic devices were also fabricated and tested, the measured bonding strength is comparable to the conventional thermal fusion bonding method. The biocompatibility of the proposed bonding method was also evaluated by culturing bacteria in the PES adhesive covered culture dish. The proposed bonding method for thermoplastic-based microfluidic is especially suitable for the massive fabrication of POCT devices with advantages in processing speed, instrument requirement, cost, and bonding strength.