氧化铈
抛光
纳米颗粒
化学机械平面化
材料科学
壳体(结构)
铈
氧化物
纳米技术
芯(光纤)
化学工程
冶金
复合材料
工程类
作者
Xiaohai He,Bo Gao,Qingyuan Wu,C. Xin,Junjie Xue,Fangwei Lu,Xin-Ping Qu,Song Li,Fan Zhang,Hui Shen
摘要
Chemical mechanical polishing (CMP) represents one of the most important steps in the manufacturing of integrated circuits and high surface quality is always required for the CMP processes of shallow...
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