聚酰亚胺
图层(电子)
材料科学
光电子学
纳米技术
作者
Lily Liu,Changbin Song,Bin Xue,Jing Li,Junxi Wang,Jinmin Li
出处
期刊:Journal of Semiconductors
[IOP Publishing]
日期:2018-02-01
卷期号:39 (2): 026001-026001
被引量:3
标识
DOI:10.1088/1674-4926/39/2/026001
摘要
Positive type photosensitive polyimide is used as the modification layer in the thin film transistors production process. The photosensitive polyimide is not only used as the second insulating layer, it can also be used instead of a mask because of the photosensitivity. A suitable curing condition can help photosensitive polyimide form the high performance polyimide with orderly texture inside, and the performance of imidization depends on the precise control of temperature, time, and heat control during the curing process. Therefore, experiments of different stepped up heating tests are made, and the ability of protecting silicon dioxide is analyzed.
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