Static and Dynamic Thermomechanical Properties of Phase-Separated Epoxy Networks with Tuned Microstructures
环氧树脂
微观结构
材料科学
复合材料
相(物质)
物理
量子力学
作者
Brad H. Jones,Francesca M. C’deBaca,Erin J. Nissen,Angela Y. Ku,Jessica Kopatz,Nha Uyen Huynh,Samuel C. Leguizamon,Kylie E. Van Meter
出处
期刊:ACS applied polymer materials [American Chemical Society] 日期:2024-10-19卷期号:6 (21): 13147-13157
标识
DOI:10.1021/acsapm.4c02347
摘要
Polymerization-induced phase separation is a useful method for the construction of heterogeneous epoxy networks with properties exceeding their homogeneous counterparts. In this work, we examine the static and dynamic thermomechanical properties of phase-separated epoxy networks salient to their application as encapsulants. Three heterogeneous epoxy-amine networks with nano-, meso-, and macro-phase-separated morphologies comprised of hard and soft domains are compared to a rigid, unstructured network. The glass transition profiles of the heterogeneous networks are complex, spanning many decades in the frequency domain. The nanophase-separated morphology leads to higher coefficient of thermal expansion, yet surprisingly is characterized by reduced residual stress. Under both quasi-static and dynamic compression (strain rates of order 10–3 and 103 s–1, respectively), the nanophase-separated network also exhibits higher modulus and strength. In split-Hopkinson bar experiments, the energy dissipation characteristics of the epoxy networks were nearly identical. Curiously, however, the Hugoniot response of the macro-phase-separated network determined by ballistic shockwave analysis indicates a remarkable ability of this material to mitigate shockwave propagation in comparison to many homogeneous and heterogeneous polymer materials. Collectively, this work reveals several previously unreported phenomena with respect to structure–property relationships in phase-separated epoxy networks, illustrating the potential value of systematically tuned microstructures for optimization of application-specific physical properties.