激光器
激光功率缩放
激光切割
材料科学
光学
表面粗糙度
注射播种机
功率(物理)
GSM演进的增强数据速率
光电子学
计算机科学
电信
复合材料
物理
量子力学
作者
Jimin Chen,Chao Huang,Shaoxian Bai
摘要
Usually when cutting thicker material we need higher power laser during laser cutting. If we use a saw to cut the situation will be different. In this paper we report a novel technology for thick glass cutting with a small power laser saw. The laser saw is made of 532nm green laser with long pulse width 550µs. It is not a special but an ordinary green laser. The special focus point of laser can be moving up and down at high frequency with the control lens. During cutting it works like a saw so we call it laser saw. The average power of the laser is approximately 0.7W much less than 1W. However with this small power laser we can cut over 10mm thick glass. The cutting speed can be 1m/min. The roughness of the cutting surface is about 10 micron meters. There is no obvious crack on the edge of kerf. It shows great potential application with this laser saw technology.
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