CMOS芯片
材料科学
微电子机械系统
电容
电子工程
集成电路
炸薯条
光电子学
模具(集成电路)
压力传感器
电气工程
工程类
纳米技术
物理
机械工程
量子力学
电极
作者
Saoni Banerji,Daniel Fernández,Jordi Madrenas
出处
期刊:IEEE Sensors Journal
[Institute of Electrical and Electronics Engineers]
日期:2017-08-30
卷期号:17 (20): 6653-6661
被引量:21
标识
DOI:10.1109/jsen.2017.2747140
摘要
Comprehensive characterization results of CMOS-microelectromechanical systems resonant pressure sensor are presented. We have extensively evaluated the key performance parameters of our device in terms of quality factor (Q) variations under variable conditions of temperature and pressure, characterized by Knudsen number (K n ). The fundamental frequency of the reported device is 104.3 kHz. Over the full-scale pressure range of 0.1 to 100 kPa and a temperature range of -10 °C to 85 °C, Q from 450 to 62.6 have been obtained. Besides, static variations of the device capacitance have been measured and analyzed with temperature to evaluate the spring softening and the pull-in effects. A nonlinearity analysis has been performed to assess the device stability. Furthermore, a statistical mismatch analysis has been carried out to determine the deviation of resonance with etching time and ascertain maximum device yield. With our in-house back-end of line metal-layer release, this sensor can be monolithically embedded in the same substrate as standard CMOS integrated circuits, resulting in a significant cost and area reduction.
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