材料科学
热导率
环氧树脂
光电子学
电磁辐射
吸收(声学)
反射损耗
介电损耗
电介质
复合材料
光学
复合数
物理
作者
Yongxian Qian,Tao Yang,You Li,Jinian Hao,Chaochao Xu,Yan Wei,Qinghui Jiang,Yubo Luo,Jing Yang
标识
DOI:10.1016/j.cej.2022.136033
摘要
Exploiting electronic packaging materials with simultaneously high thermal conductivity and electromagnetic wave absorbing capacity has been considered as a key strategy to resolve the ever-increasing heat flux density and electromagnetic interference of integrated circuits, although it is hard to achieve. Here, we report 3D [email protected] filled epoxy resin (i.e., [email protected]/EP) as a promising candidate. 3D [email protected] was created by self-assembling negative charged hydroxyl-modified hBN on the surface of positive charged melamine foam through electrostatic effect, and subjected to carbonization at 900 ℃. In which, the hBN can enhance the dielectric loss capability and impedance matching of MDCF, resulting in the minimum reflection loss (RL)value of − 52.77 dB at 9.36 GHz and the maximum effective absorption bandwidth of 5.60 GHz (from 12.40 to 18.00 GHz) for 25 wt% [email protected] filled EP. In addition, the 3D [email protected] also acts an effective heat propagation path in EP, leading to a high thermal conductivity of 0.99 W·m−1 K−1 at room temperature, 450% higher than that of pristine EP. The coalesced high thermal conductivity and electromagnetic wave absorption performance in EP indicate that [email protected]/EP has a promising practical application in high-power integrated circuits.
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