灰烬
钥匙(锁)
吞吐量
材料科学
冶金
化学
计算机科学
相图
操作系统
相(物质)
有机化学
无线
作者
Chih-han Yang,Yuchen Liu,Yuki Hirata,Hiroshi Nishikawa,Shih‐kang Lin
出处
期刊:Social Science Research Network
[Social Science Electronic Publishing]
日期:2021-01-01
被引量:1
摘要
Low-temperature Pb-free solders are in demand to alleviate the warpage issue during reflow process for high-density electronic packaging. The eutectic Sn-58Bi solder (Sn58Bi) with good mechanical properties and low melting temperature at 139°C has drawn great interests in the industry. However, the Bi-rich phase coarsened after being thermally aged deteriorated the solder joint's reliability significantly. Therefore, designing proper alloying constituents for improving the mechanical properties of Sn58Bi is necessary. Herein, we performed high-throughput CALPHAD modeling and systematically screened 35,343 alloy compositions of the Sn-Bi-Ag-In (SBAI) and Sn-Bi-Ag-Zn (SBAZ) systems. Optimal SBAI and SBAZ quaternary alloys were proposed, experimentally characterized based on microstructural, thermal and mechanical analyses, and their phase equilibria and solidification reactions are elaborated. The designed SBAI alloy shows superior mechanical properties including ultimate tensile strength, elongation and toughness in both the as-cast and thermally-aged conditions, which is a potential candidate for low-temperature applications.
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