平版印刷术
抵抗
下一代光刻
极紫外光刻
光刻
计算光刻
薄脆饼
浸没式光刻
X射线光刻
材料科学
多重图案
电子束光刻
模版印刷
纳米技术
涂层
无光罩微影
光电子学
图层(电子)
作者
R He,Jianrui Cheng,Fan Wang
标识
DOI:10.1007/978-981-99-2836-1_65
摘要
Lithography technology is one of the most important processes for IC manufacturing. It determines the smallest feature size that could be achieved by humans in high-volume manufacturing (HVM). In the past six decades, lithography technology has pushed Moore’s law forward by shrinking the feature size from previous several microns to current technology node of 3 nm. Resist coating, exposure, and development are usually considered as the three crucial steps in the lithography process, and they are typically achieved by lithography equipment and wafer track system. This chapter reviews the history of photolithography equipment for HVM mainly from the aspects of proximity lithography equipment, wafer steppers, wafer scanners, and immersion scanners, together with EUV lithography equipment. Also, it introduces the alternatives applied in IC manufacturing such as electron beam lithography equipment, multiple e-beam lithography equipment, and nanoimprint equipment. Finally, other equipment for resist coating and develop processes such as wafer track and wet stripping are presented.
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