阳极
电解质
电化学
锂(药物)
溶剂化
溶剂
材料科学
电镀(地质)
剥离(纤维)
化学工程
无机化学
化学
物理化学
复合材料
有机化学
电极
工程类
医学
内分泌学
地质学
地球物理学
作者
Junhao Wang,Jing Luo,Haichuan Wu,Xiaoyu Yu,Xiaohong Wu,Zhengang Li,Haiyan Luo,Haitang Zhang,Yuhao Hong,Yeguo Zou,Shuo‐Hui Cao,Yu Qiao,Shi‐Gang Sun
标识
DOI:10.1002/anie.202400254
摘要
Abstract Acting as a passive protective layer, solid‐electrolyte interphase (SEI) plays a crucial role in maintaining the stability of the Li‐metal anode. Derived from the reductive decomposition of electrolytes (e.g., anion and solvent), the SEI construction presents as an interfacial process accompanied by the dynamic de‐solvation process during Li‐metal plating. However, typical electrolyte engineering and related SEI modification strategies always ignore the dynamic evolution of electrolyte configuration at the Li/electrolyte interface, which essentially determines the SEI architecture. Herein, by employing advanced electrochemical in situ FT‐IR and MRI technologies, we directly visualize the dynamic variations of solvation environments involving Li + ‐solvent/anion. Remarkably, a weakened Li + ‐solvent interaction and anion‐lean interfacial electrolyte configuration have been synchronously revealed, which is difficult for the fabrication of anion‐derived SEI layer. Moreover, as a simple electrochemical regulation strategy, pulse protocol was introduced to effectively restore the interfacial anion concentration, resulting in an enhanced LiF‐rich SEI layer and improved Li‐metal plating/stripping reversibility.
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