作者
Daohuan Feng,Yi Jiang,Yunsong Qiu,Yuhong Zheng,Harry K.W. Kim,Jae-Woo Kim,Jian Chu,Guangsu Shao,Yu‐Cheng Liao,C. L. Yang,Minrui Hu,Wenli Zhao,Linjiang Xia,Jianfeng Xiao,Di Ma,Yuan Cheng,Xiangbo Kong,Chao Lin,Tianming Li,Yongjie Li,Jingheng Meng,Kai Shao,Yan Wang,Xiaoàn Yang,Xiang Liu,Qinghua Han,Huiming Li,Yanzhe Tang,Mingde Liu,E. Wu,Xiaoping Li,Renrui Huang,Mingtang Zhang,Long Hou,Xuan Pan,Xinwen Jin,Shui-Ping Zhao,Dh Han,Ted Park,Deyuan Xiao,Chao Zhao,Abraham Yoo
摘要
In this work, a novel 4F 2 VCT (vertical channel transistor) targeting for next generation of DRAM is proposed. We approached process feasibility and device performance of $\mathbf{4 F}^{2}$ VCT by TCAD simulation. Detailed processes such as BL (bit line) and WL (word line) loop have also been discussed to achieve lx node VCT DRAM. For the first time, silicon demonstration for $8\mathrm{~Gb}$ full array VCT with density as high as $198\ \mathrm{Mbit}/\mathrm{mm}^{2}$ is successfully realized. Besides, we also demonstrated standard switching behavior of VCT access transistor with reasonable device performance.