锡
材料科学
金属间化合物
微观结构
扫描电子显微镜
离子镀
铜
结晶
图层(电子)
铬
冶金
基质(水族馆)
钛
化学工程
薄膜
复合材料
合金
纳米技术
工程类
地质学
海洋学
出处
期刊:Chinese Physics
[Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences]
日期:2000-01-01
卷期号:49 (11): 2220-2220
摘要
TiN/Ti film was fabricated by deposition on the chromium layer electrodeposited on the copper substrate by means of multi-arc ion plating technique under different conditions.The interface formation,microstructure and constituents,and morphology for TiN/Ti and Cr/Cu contact system are investigated using X-ray diffraction (XRD) and scanning electron microscope (SEM) techniques.The XRD measurements showed that in addition to the TiN,Ti2N multi-crystallized phases,there was a lot of Cr-Ti,intermetallic compounds on the surface of TiN/Ti film.It is evident that the Ti2N phase was formed.The SEM observation indicated that the surface film prepared at 90℃,had a structure similar to the form of branches and an inhomogeneous crystallization had occurred.As the temperature was increased to 170℃,the XRD peak intensity became stronger and a fine TiN/Ti surface was obtained.
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