Optimization of fin profile and implant in bulk FinFET technology

A comprehensive analysis of fin profile effect on bulk FinFET device characteristics is described in this paper. Optimal fin profile and anti-punch-through (APT) implant profile are important to DC performance and multiple-Vt offering capability, which are essential for system-on-chip (SoC) applications. This study provides practical device design guidelines for bulk FinFET technology.