焊接
材料科学
微观结构
扫描电子显微镜
冶金
抗剪强度(土壤)
合金
锡膏
铟
剪切(地质)
基质(水族馆)
复合材料
海洋学
环境科学
土壤科学
土壤水分
地质学
作者
Yi-Ta Wang,Cheng Jen Ho,H. Y. Tsai
标识
DOI:10.1109/nems.2013.6559900
摘要
In this study, trace amounts (0.5–2 wt%) of indium (In) are added to the Pb-free Sn-9Zn solder. Expect to improve the mechanical properties and find out the optimum conditions of Sn-9Zn-In solder. Tests are conducted to measure micro-hardness and shear strength while microstructure and morphology of fracture surface are observed using scanning electron microscope with elemental composition analyzed by energy dispersive spectrometer. Results show that addition of In to Sn-9Zn solder alloy leads to needle-shaped precipitates formed in the substrate. This not only increases micro-hardness, but also enhances shear strength at Sn-9Zn-In/Cu solder joints. Improvements in both micro-hardness and shear strength confirm that adding In to the solder alloy can contribute to better mechanical properties of Sn-9Zn-In/Cu joints with proper control of soldering temperature and time.
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