Surface generation mechanism of ceramic matrix composite in ultrasonic assisted wire sawing

Ceramic matrix composites (CMC) are highly required in many fields of science and engineering. However, the CMC parts always have poor surface finish. This study attempts to improve cutting performance of CMC material by combing the advantages of ultrasonic assisted cutting and diamond wire sawing. Cutting force, surface roughness, machined edge and tool wear are analyzed based on experimental results. It shows that the oscillatory movement of tool edges provides positive effect on particle ejection and residual material reduction. Ductile chip formation can be achieved due to the small tip radius of grits. Obvious decrease in cutting force, surface roughness and tool wear are obtained. Moreover, burrs, fuzzing and fracture are reduced. Meanwhile, both the surface characteristics and shape accuracy are significantly improved. These results provide a valuable basis for application of ultrasonic assisted wire sawing and understanding of CMC cutting mechanisms.