硅
薄脆饼
氢
降级(电信)
退火(玻璃)
掺杂剂
活化能
材料科学
化学
化学物理
分析化学(期刊)
兴奋剂
光电子学
物理化学
复合材料
电子工程
有机化学
工程类
色谱法
作者
Daniel Chen,Phillip Hamer,Moonyong Kim,Catherine Chan,Alison Ciesla nee Wenham,Fiacre Rougieux,Yuchao Zhang,Malcolm Abbott,Brett Hallam
标识
DOI:10.1016/j.solmat.2019.110353
摘要
Light- and elevated temperature-induced degradation (LeTID) has been extensively studied on p-type silicon materials with increasing evidence suggesting the involvement of hydrogen. Recent findings of the identical phenomenon in n-type silicon wafers have further opened up new areas of understanding into the inherent behavior and root cause of the defect. In this work, we compare LeTID observed in both p- and n-type silicon wafers under both dark and illuminated annealing conditions, highlighting previously unobserved similarities in defect formation and recovery kinetics. We report thermal activation energies of the LeTID-related degradation and recovery in n-type silicon to be 0.76 ± 0.02 eV and 0.97 ± 0.01 eV without illumination, respectively, and 0.70 ± 0.05 eV and 0.83 ± 0.15 eV under illumination (0.02 kWm−2), respectively. Furthermore, we present additional experimentation demonstrating the thermal and illumination dependency of surface-related degradation (SRD) in n-type silicon. We report an extracted activation energy of this SRD of 0.38 ± 0.10 eV. Through modelling of the hydrogen charge state fractions, we speculate that the behavior of LeTID both in the dark and under illumination may be explained by the migration of and interactions between charged hydrogen species and dopant atoms within the diffused layers and the silicon bulk.
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