粘附
辐照
光子
半导体
薄膜
材料科学
金属
光电子学
化学
光化学
纳米技术
复合材料
光学
冶金
物理
核物理学
作者
A. J. Kellock,G.L. Nyberg,J. S. Williams
出处
期刊:Vacuum
[Elsevier]
日期:1985-12-01
卷期号:35 (12): 625-628
被引量:14
标识
DOI:10.1016/0042-207x(85)90326-4
摘要
This paper outlines several observations relating to the modification of the adhesion of thin Al and Au films to semiconductors and oxides by photon irradiation at energies up to 21 eV. Results provide strong evidence that secondary processes (i.e. charged carriers generated by the incident photons) play a major role in bonding rearrangements and adhesion improvement at metal-non-metal interfaces.
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