Spectra-Dependent Stability of the Passivation Quality of Al2O3/c-Si Interfaces

We examine the stability of the c-Si surface passivation quality by spatial atomic-layer-deposited aluminum oxide (Al2O3), plasma-enhanced chemical vapor deposited silicon nitride (SiN x ), and Al2O3/SiN x stacks under illumination with two different spectra. The Al2O3-passivated c-Si surfaces annealed at 350 °C show a weak degradation due to UV illumination, with surface recombination velocities (SRVs) of 122 cm/s after receiving a ultraviolet (UV) dose of 275 kWh/m2. Silicon samples passivated with Al2O3 layers that received a fast-firing step show an improvement due to UV illumination with a reduction of the SRVs initially from 14 to 5 cm/s for single Al2O3 layers. For the fired Al2O3 layers the negative fixed charge density increases from −6×1012 cm−2 up to −1.2×1013 cm−2 during UV illumination. We demonstrate that for the SiN x and the fired Al2O3 single layers, photons with energy greater than 3.4 eV are necessary to reduce the passivation quality. In contrast, low-temperature-annealed Al2O3 single layers and nonfired Al2O3/SiN x stacks showed a degradation already under illumination with a halogen lamp. Importantly, we observe a perfectly stable passivation on boron-diffused p + emitter for fired Al2O3/SiN x stacks featuring a stable saturation current density of 18 fA/cm2 for a p + sheet resistance of 90 Ω/sq.