Lv2
170 积分 2024-02-27 加入
Electrochemical additive manufacturing of copper parts: printed material properties vs. traditionally deposited
1个月前
已完结
Manufacturing of high strength and high conductivity copper with laser powder bed fusion
1个月前
已完结
Additive manufacturing of micro‐architected copper based on an ion‐exchangeable hydrogel
1个月前
已完结
Additive Manufacturing of a Steel–Ceramic Multi-Material by Selective Laser Melting
1个月前
已完结
Thick Film Copper Bonding for Highly Reliable Ag-free MetalCeramic Substrates
4个月前
已完结
Cu patterns with high adhesion strength and fine resolution directly fabricated on ceramic boards by ultrafast laser modification assisted metallization
5个月前
已完结
Transient Thermal Impedance Measurement of HPD Power Modules
5个月前
已完结
A Compact 175°C High Temperature Gate Driver with Isolated Power Supply and Advanced Protection for HybridPACK Drive SiC Module
5个月前
已完结
Tunnel Magnetoresistance-Based Short-circuit Protection for SiC MOSFET in HybridPACK™ Drive Package
5个月前
已完结
An 820A 750V Compact IGBT Module with New Chip Technology for Automotive Inverter Application
5个月前
已完结
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