Lv11
48 积分 2024-07-20 加入
Nanodiamond vacuum field emission microtriode
3小时前
已完结
Printable, stretchable metal-vapor-desorption layers for high-fidelity patterning in soft, freeform electronics
5个月前
已完结
Ultra‐High Interfacial Thermal Conductance via Double hBN Encapsulation for Efficient Thermal Management of 2D Electronics
7个月前
已完结
Extreme Thermal Insulation and Tradeoff of Thermal Transport Mechanisms between Graphene and WS2 Monolayers
7个月前
已完结
柔性石墨膜的制备及其导热性能研究
7个月前
已完结
Mitigating the Overheat of Stretchable Electronic Devices Via High‐Enthalpy Thermal Dissipation of Hydrogel Encapsulation
7个月前
已完结
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