Lv6
2160 积分 2023-11-07 加入
Near-Theoretical Thermal Conductivity Silver Nanoflakes as Reinforcements in Gap-Filling Adhesives
2天前
已完结
Low-Temperature Fusible Silver Micro/Nanodendrites-Based Electrically Conductive Composites for Next-Generation Printed Fuse-Links
26天前
已完结
Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications
1个月前
已完结
Ice‐Templated, Large‐Area Silver Nanowire Pattern for Flexible Transparent Electrode
1个月前
已完结
Microstructure and properties of Cu/Si composites for electronic packaging: Effect of tungsten layer on silicon particles
3个月前
已完结
Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy technique
3个月前
已完结
Cooperative Bilayer of Lattice-Disordered Nanoparticles as Room-Temperature Sinterable Nanoarchitecture for Device Integrations
3个月前
已完结
Mechanical properties and microstructure of low temperature sintered joints using organic-free silver nanostructured film for die attachment of SiC power electronics
3个月前
已完结
Sintering Mechanism of a Supersaturated Ag–Cu Nanoalloy Film for Power Electronic Packaging
3个月前
已完结
Rapid Fabrication of High-Resolution Flexible Electronics via Nanoparticle Self-Assembly and Transfer Printing
3个月前
已完结
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