Lv3
244 积分 2022-05-06 加入
Thermal design of microchannel heat sinks using a contour extraction based on topology optimization (CEBTO) method
12小时前
已完结
3D topology optimisation of liquid-cooled microchannel heat sinks
15小时前
已完结
Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames
1个月前
已完结
Loop heat pipe dynamics modeling and analysis
1个月前
已完结
Development of a reduced-order AROMM model for the nonlinear thermal simulation of electronic components
2个月前
已完结
高精度な半導体パッケージ向けコンパクト熱モデル構築に向けた検証と考察─表面実装型ディスクリートパワー半導体パッケージモデル作成のための要件─
2个月前
已关闭
Extension of the DELPHI methodology to Dynamic Compact Thermal Model of electronic component
2个月前
已完结
Thermal Analysis of Components and Traces on Printed Circuit Boards
3个月前
已完结
Thermo-mechanical fatigue induced unexpected strain hardening of Cu clip wiring on transfer-mold type EV power modules
3个月前
已完结
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