Lv2
110 积分 2023-07-23 加入
Fast prediction of electromigration lifetime with modified mean-time-to-failure equation
6个月前
已完结
« Une Vie » / Des Vides, ou le Nom de la Mère
7个月前
已关闭
Study on the interfacial evolution and mechanical properties of Cu/SAC105/Cu solder joint modified by Si3N4 nanowires
1年前
已完结
Microstructure evolution and thermal, wetting, mechanical properties of SiC nanowires reinforced SAC105 composite solder
1年前
已完结
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