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24 积分 2024-08-23 加入
Numerical simulation of cooling performance of heat sink designed based on symmetric and asymmetric leaf veins
2天前
已完结
Temperature uniformity in convective leaf vein-shaped fluid microchannels for phased array antenna cooling
2天前
已完结
Temperature uniformity in convective leaf vein-shaped fluid microchannels for phased array antenna cooling
2天前
已完结
Multi-objective optimization design of lithium-ion battery liquid cooling plate with double-layered dendritic channels
3天前
已完结
Diamond Resistives - The Passive Way to Manage the Heat and Keep the VSWR Low at High Frequencies
10天前
已完结
Structural and thermal analysis of polycrystalline diamond thin film grown on GaN-on-SiC with an interlayer of 20 nm PECVD-SiN
11天前
已完结
High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes
11天前
已完结
Interface Engineering Enabling Next Generation GaN-on-Diamond Power Devices
11天前
已完结
Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers
11天前
已完结
Understanding the Role of Near-Junction Diamond Heat Spreaders in Packaged 20-Gate GaN HEMT Chips via Thermal Simulation
26天前
已完结
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