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90 积分 2023-12-11 加入
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
23天前
已完结
Processing Through Glass Via (TGV) Interposers for Advanced Packaging
11个月前
已完结
Glass Multilayer Package Substrate using Conductive Paste Via Connection
11个月前
已完结
Rapid and complex dynamics of through glass via formation using a picosecond quasi-continuous wave laser as revealed by time-resolved absorptance measurements and multiphase modeling
11个月前
已完结
Low-loss optofluidic waveguides in fused silica enabled by spatially shaped femtosecond laser assisted etching combined with carbon dioxide laser irradiation
11个月前
已完结
Etch the borosilicate glass to form a straight Through-Glass-Via -based on the FLACE technology
11个月前
已完结
Selective Cu electrodeposition for Through Glass Via (TGV)
11个月前
已完结
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