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Prospects for the future of two-dimensional materials
2天前
已完结
A novel tyrosine electrochemical sensor based on poly 3,4-ethylene-dioxythiophene and gold nanoparticles
2个月前
已完结
Copper-graphene heterostructure for back-end-of-line compatible high-performance interconnects
3个月前
已完结
Thermal and Electrical Conductivity of Copper‐Graphene Heterosystem: An Effect of Strain and Thickness
6个月前
已完结
Synthesis and characterization of homogeneously dispersed graphene–copper heterostructures with enhanced thermal properties
7个月前
已完结
Fabrication and Characterization of Copper Nanowires
8个月前
已完结
Fabrication of 100 nm pitch copper interconnects by electron beam lithography
8个月前
已完结
Review of Etchants for Copper and its Alloys in Wet Etching Processes
8个月前
已完结
Inductively coupled Ar/CH4/H2 plasmas for low-temperature deposition of ordered carbon nanostructures
9个月前
已完结
Si substrates playing two opposing roles in the process of preparing graphene by PECVD
9个月前
已完结
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