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10 积分 2023-10-24 加入
Thermal properties and failure mechanism of graphene nanoplatelet-reinforced copper composites fabricated using electroless plating
1天前
待确认
Thermal properties and failure mechanism of graphene nanoplatelet-reinforced copper composites fabricated using electroless plating
4天前
已完结
High thermal and electrical properties of electroless graphene films reinforced Cu matrix laminated composites
4天前
已完结
The influence of graphene substrate on microstructures and electrical properties of vapor-deposited copper thin films
4天前
已完结
Effects of multi-layer graphene capping on Cu interconnects
10天前
已完结
Synthesis and characterization of homogeneously dispersed graphene–copper heterostructures with enhanced thermal properties
14天前
已完结
Electro-thermal modeling and reliability analysis of Cu–carbon hybrid interconnects for beyond-CMOS computing
1个月前
已完结
Prospects for the future of two-dimensional materials
3个月前
已完结
A novel tyrosine electrochemical sensor based on poly 3,4-ethylene-dioxythiophene and gold nanoparticles
6个月前
已完结
Copper-graphene heterostructure for back-end-of-line compatible high-performance interconnects
7个月前
已完结
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