Lv4
480 积分 2024-07-07 加入
Effect of isothermal aging on the interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer
8天前
已完结
Influence of phosphorous content on microstructure development at the Ni-P Plating/SAC interface
8天前
已完结
Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls
8天前
已完结
Effect of thickness in the SAC 305 plated layer on the interfacial reaction and mechanical properties of the CCSB joint assembled onto the OSP surface finished FR-4 PCB board
8天前
已完结
Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints
8天前
已完结
Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates
8天前
已完结
Study on the interfacial reactions for Ag/Sn/Cu TLP during transient liquid phase soldering process
8天前
已完结
Growth of intermetallics between Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layered structures
8天前
已完结
Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure
8天前
已完结
Interfacial reactions on Pb-free solders with Au/Pd/Ni/Cu multilayer substrates
8天前
已完结
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