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20 积分 2021-12-15 加入
An EBSD Study of Fatigue Crack Propagation in Bonded Aluminum Wires Cycled from 55°C to 85°C
2年前
已完结
Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests
2年前
已完结
2430% Superplastic strain in a eutectic Au-Sn alloy with micrometer-sized grains maintained by spinodal-like decomposition
2年前
已完结
Fabrication and reliability assessment of cu pillar microbumps with printed polymer cores
2年前
已完结
A review on numerical approach of reflow soldering process for copper pillar technology
2年前
已完结
A review on the fabrication and reliability of three-dimensional integration technologies for microelectronic packaging: Through-Si-via and solder bumping process
2年前
已完结
Low temperature interfacial reaction in 3D IC nanoscale materials
2年前
已完结
Innovative Solder Materials for Achieving Highly Reliable Solder Joints
2年前
已完结
Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding
2年前
已完结
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