Lv7
4925 积分 2021-09-17 加入
Asymmetric bidirectional pulse electrodeposition enabling super-filling of through glass vias with large aperture and high aspect ratio
20小时前
已完结
3D IC封装中铜柱凸点和硅通孔互连的可靠性
2天前
已完结
铜填充硅通孔在热、电条件下的微结构演化及机理研究
2天前
已完结
Automated direct surface coupling of optical fibers to integrated photonics by laser welding
6天前
已完结
Aluminium surface work hardening enables multi-scale 3D lithography
11天前
已完结
Monolithic and heterogeneous three-dimensional integration of two-dimensional materials with high-density vias
13天前
已完结
三维芯片集成技术中硅通孔(TSV)的力学行为与结构完整性研究
1个月前
已完结
Investigation of Wafer Warpage Induced by Multi-layer Films
1个月前
已完结
皖公网安备34019202002308
