Lv3
378 积分 2020-04-18 加入
Across-wafer sub-1 nm critical dimension uniformity control by etch tool correction
3个月前
已完结
(Digital Presentation) Characterization and Compression Technology of Real 3D Corner Residue Between Dummy Gate and Formed Fin During an Advanced Inductive Coupled Plasma (ICP) Gate Etch Process in Advanced FinFET
4个月前
已完结
Modeling of Advanced FinFET Dummy Gate Corner Residue Impacted By Clogging
4个月前
已完结
Key Process Approach Recommendation for 5 nm Logic Process Flow with EUV Photolithography
4个月前
已完结
The Metal Gate Cut Process Development
4个月前
已完结
The Gate Cut Process Window Discussion
4个月前
已完结
(Digital Presentation) Characterization and Compression Technology of Real 3D Corner Residue Between Dummy Gate and Formed Fin During an Advanced Inductive Coupled Plasma (ICP) Gate Etch Process in Advanced FinFET
4个月前
已完结
Modeling of Advanced FinFET Dummy Gate Corner Residue Impacted By Clogging
5个月前
已完结
(Digital Presentation) Characterization and Compression Technology of Real 3D Corner Residue Between Dummy Gate and Formed Fin During an Advanced Inductive Coupled Plasma (ICP) Gate Etch Process in Advanced FinFET
5个月前
已完结
Saving scribe-lane space by using narrow alignment marks
6个月前
已完结
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