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46 积分 2024-06-22 加入
Chemical-mechanical synergies effects of multi-purpose pH regulators on C-, A-, and R-plane sapphire polishing
14小时前
待确认
Effects of pyrazine and its derivatives as inhibitors on copper film chemical-mechanical polishing properties for ruthenium-based copper interconnect
18小时前
已关闭
Effect of glycine on copper CMP
2个月前
已关闭
Effect of pH on Hard Disk Substrate Polishing in Glycine-Hydrogen Peroxide System Abrasive-Free Slurry
2个月前
已关闭
Effect of DL-alanine as an auxiliary complexing agent in TSV copper film CMP
2个月前
已完结
From Synthesis of Amino Acids and Peptides to Enzymatic Catalysis: A Bottom‐Up Approach in Mechanochemistry
2个月前
已完结
Electrochemical characterization of copper chemical mechanical polishing in l-glutamic acid–hydrogen peroxide-based slurries
2个月前
已完结
Effect of DL-alanine as an auxiliary complexing agent in TSV copper film CMP
2个月前
已关闭
Experimental and theoretical analysis of single-sided and double-sided chemical mechanical polishing of sapphire wafers
2个月前
已完结
Development, applications and challenges of ReaxFF reactive force field in molecular simulations
5个月前
已完结
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