Lv5
940 积分 2024-05-04 加入
Effect of Cu element addition on the interfacial behavior and mechanical properties of Sn9Zn-1Al2O3 soldering 6061 aluminum alloys: First-principle calculations and experimental research
21天前
已完结
Flexible Mechanical Metamaterials Enabled Electronic Skin for Real‐Time Detection of Unstable Grasping in Robotic Manipulation
23天前
已完结
High-performance cellulose nanofiber-derived composite films for efficient thermal management of flexible electronic devices
23天前
已完结
Development of the Third-generation Semiconductor Interconnect Materials and Progress of Low-temperature Sintering of Copper Nanoparticles
26天前
已完结
Revealing effects of common nonmetallic impurities on the stability and strength of Cu–Sn solder joints: A first-principles investigation
27天前
已完结
Strengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation
27天前
已完结
Preferred orientation at the Al/graphene interface: First-principles calculations and experimental observation
27天前
已完结
A systematic study of interface properties and fracture behavior of graphene/aluminum: Insights from a first-principles study
27天前
已完结
Low-temperature metallization of SiC ceramic with Sn0.5Zn via ultrasound assisted formation of an amorphous transition layer
27天前
已完结
Review of ultrasonic-assisted soldering in Sn-based solder alloys
27天前
已完结
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