Lv1
8 积分 2022-04-07 加入
Stress-initialed void formation during cure of a three-dimensionally constrained thermoset resin
1天前
已完结
Room-Temperature Formation of a ZnO-Based Adhesion Layer for Nanoprecision Cu/Glass Metallization
1年前
已完结
Adhesion of Electroless Deposited Cu on ZnO‐Coated Glass Substrates: The Effect of the ZnO Surface Morphology
1年前
已完结
Growth and Extension of One-Step Sol–Gel Derived Molybdenum Trioxide Nanorods via Controlling Citric Acid Decomposition Rate
1年前
已完结
Controlled Mechanical Adhesion of Electroless Cu Patterns
1年前
已完结
Role of Surface Tension Gradients in Correcting Coating Defects in Corners
1年前
已完结
The Mechanical Theory of Adhesion
1年前
已完结
Thermal-stress analysis of hollow cylinder with temperature-dependent thermal conductivity
1年前
已完结
Examination of Etching Agent and Etching Mechanism on Femotosecond Laser Microfabrication of Channels Inside Vitreous Silica Substrates
1年前
已完结
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