Lv3
352 积分 2024-04-10 加入
SiC Power Electronics Packaging Prognostics
3小时前
已完结
Thermal Expansion Mismatch in Electronic Packaging
3小时前
已完结
Effect of Gold on the Microstructural Evolution and Integrity of a Sintered Silver Joint
3小时前
已完结
Cu-Au, Ag-Au, Cu-Ag, and Ni-Au intermetallics: First-principles study of temperature-composition phase diagrams and structures
3小时前
已完结
Ternary diffusion in copper-silver-gold alloys
3小时前
已关闭
Tabulated potentials in molecular dynamics simulations
3小时前
已完结
Computer simulation of liquid metals
4小时前
已完结
Active learning of uniformly accurate interatomic potentials for materials simulation
4小时前
已完结
Thermally stable high temperature die attach solution
3天前
已完结
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