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28 积分 2023-09-13 加入
Micro-cracks Generation and Growth Manipulation by All-Laser Processing for Low Kerf-loss and High Surface Quality SiC Slicing
1个月前
已完结
Heat management with a twist in layered materials
5个月前
已完结
Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures
6个月前
已完结
Recent Advances and Trends in Advanced Packaging
8个月前
已完结
High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes
8个月前
已完结
Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures
8个月前
已完结
Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management
8个月前
已完结
A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces
8个月前
已完结
Heat transfer characteristics of thermal energy storage system using single and multi-phase cooled heat sinks: A review
8个月前
已完结
GaN-on-diamond materials and device technology: A review
8个月前
已完结
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