Lv5
1010 积分 2023-02-23 加入
An active ester‐cured resveratrol‐based epoxy film with excellent thermal and dielectric performances for high‐frequency applications
9天前
已完结
Thermally Conductive Yield‐Stress Fluids with Reversible Solid–Liquid Transition Used as Thermal Interface Materials for Heat Dissipation of Chips
29天前
已完结
Polymer Composites for Embedded Capacitors
1个月前
已完结
Polymer dielectrics for high-temperature energy storage: Constructing carrier traps
1个月前
已完结
Dual‐Effect Coupling for Superior Dielectric and Thermal Conductivity of Polyimide Composite Films Featuring “Crystal‐Like Phase” Structure
1个月前
已完结
Polymer composites with high thermal conductivity: Theory, simulation, structure and interfacial regulation
1个月前
已完结
High-solubility aromatic polyesters with fluorene and phthalein groups: Synthesis and property
3个月前
已完结
Electronic Packaging: Materials and Their Properties
3个月前
已完结
High‐Temperature Polymer‐Based Dielectrics for Advanced Electronic Packaging
3个月前
已完结
Ultra-high cross-linked active ester-cured epoxy resins: side group cross-linking for performance enhancement
6个月前
已完结
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