Lv3
270 积分 2024-11-17 加入
Mass transfer technique for high-density 2D FET arrays
1个月前
已完结
Transfer printing by kinetic control of adhesion to an elastomeric stamp
1个月前
已完结
A mass transfer technology for high-density two-dimensional device integration
3个月前
已完结
Graphene-assisted metal transfer printing for wafer-scale integration of metal electrodes and two-dimensional materials
3个月前
已完结
Comparison of PMMA shrinkage in ion beam lithography: PMMA on glass substrate vs free-standing PMMA film
3个月前
已完结
Reconfigurable logic-in-memory architectures based on a two-dimensional van der Waals heterostructure device
5个月前
已完结
Reconfigurable logic-in-memory architectures based on a two-dimensional van der Waals heterostructure device
5个月前
已完结
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