Lv51
898 积分 2022-03-18 加入
Influence of organic capping layers on the performance of transparent organic light-emitting diodes
2小时前
已完结
Advanced packaging of chiplets for future computing needs
9个月前
已完结
Research progress on displays and optical adhesives for flexible 3C products
10个月前
已完结
Does the viscoelastic behavior of fully cured epoxy depend on the thermal history during curing?
10个月前
已完结
Influence of the cure state on mechanical properties of an epoxy‐based adhesive: Experimental characterization and numerical simulation
10个月前
已完结
High performance UV and thermal cure hybrid epoxy adhesive
11个月前
已完结
Wavelength-Dependent Photochemistry of Oxime Ester Photoinitiators
11个月前
已完结
FTIR Analysis of the Curing Behaviors of Bi‐Functional Epoxy Resin with Anhydride Based Hardener
11个月前
已完结
A Study on Back Grinding Tape for Ultra-thin Chip Fabrication
11个月前
已完结
Hydrophobic Modification of Silica Surfaces via Grafting Alkoxy Groups
1年前
已完结
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