Lv51
808 积分 2022-03-18 加入
Advanced packaging of chiplets for future computing needs
4个月前
已完结
Research progress on displays and optical adhesives for flexible 3C products
5个月前
已完结
Does the viscoelastic behavior of fully cured epoxy depend on the thermal history during curing?
5个月前
已完结
Influence of the cure state on mechanical properties of an epoxy‐based adhesive: Experimental characterization and numerical simulation
5个月前
已完结
High performance UV and thermal cure hybrid epoxy adhesive
6个月前
已完结
Wavelength-Dependent Photochemistry of Oxime Ester Photoinitiators
6个月前
已完结
FTIR Analysis of the Curing Behaviors of Bi‐Functional Epoxy Resin with Anhydride Based Hardener
6个月前
已完结
A Study on Back Grinding Tape for Ultra-thin Chip Fabrication
6个月前
已完结
Hydrophobic Modification of Silica Surfaces via Grafting Alkoxy Groups
10个月前
已完结
Surface properties and dispersion behaviour of precipitated silicas
10个月前
已完结
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