环氧树脂
材料科学
电介质
固化(化学)
复合材料
微电子
复合环氧材料
聚合物
胶衣
合成树脂
数码产品
纳米技术
光电子学
物理化学
化学
作者
Yalan Wu,Xuerong Fan,Zhen Wang,Zhiming Zhang,Zheng Liu
摘要
Abstract Epoxy resins are widely utilized in electronics, electrical components, and communication equipment for polymer‐based wave‐transparent composites. However, the dielectric constant ( ε ) and dielectric loss (tan δ ) of common epoxy resins are relatively high ( ε for 3.8–4.2; tan δ for 0.018–0.025), and the corresponding impact resistance is poor. Thus, it cannot meet the requirements of advanced microelectronic materials. And the epoxy resins prepared by filling the inorganic fillers are difficult to combine the low ε with good machining performance. The ε and tan δ of intrinsic epoxy resins can be decreased by the synthesis of epoxy monomers and curing agents and the optimization of the final curing network. Meanwhile, the use of some special processing methods, such as the electrospinning technology, is also conducive to reducing the ε and tan δ values of final epoxy‐cured resins. The factors affecting the dielectric properties of epoxy‐cured resins, and the common methods to decrease the ε value of epoxy‐cured resins are reviewed in this article. Then, the design, synthesis and research progress of ultra‐low ε epoxy resins are investigated with the relevant academic results. Finally, the development trends and application prospects of the ultra‐low ε epoxy resins are discussed.
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