电容器
陶瓷电容器
陶瓷
数码产品
电气工程
材料科学
电介质
薄膜电容器
可靠性(半导体)
工程物理
介电强度
电力电子
复合材料
光电子学
工程类
功率(物理)
电压
物理
量子力学
作者
M-J. Pan,Clive A. Randall
出处
期刊:IEEE Electrical Insulation Magazine
[Institute of Electrical and Electronics Engineers]
日期:2010-05-01
卷期号:26 (3): 44-50
被引量:440
标识
DOI:10.1109/mei.2010.5482787
摘要
A century of diligent R&D has resulted in a wide range of ceramic dielectrics and processing technologies. The technology used to manufacture an MLCC (multilayer ceramic capacitors) that costs pennies was unimaginable 30 years ago. The present trends of enhanced mobility, connectivity, and reliability in consumer, industrial, and military electronics will continue to drive future innovations in ceramic capacitor technology. In addition, power electronics applications are an emerging market in which ceramic capacitors will play an increasing role through improved breakdown strength, enhanced dielectric stability in harsh environments, and innovative packaging. The investment made by the US government to develop high energy density and high temperature capacitor technology will also contribute to the advancement of dielectric materials technology for pulse and power electronic capacitors.
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