材料科学
复合材料
阳极连接
熔块
残余应力
激光器
压力(语言学)
光学
图层(电子)
语言学
物理
哲学
作者
Yang Li,Rui Tian,Luqiao Yin,Jianhua Zhang
出处
期刊:Optical Engineering
[SPIE - International Society for Optical Engineering]
日期:2017-08-18
卷期号:56 (08): 1-1
被引量:2
标识
DOI:10.1117/1.oe.56.8.083103
摘要
This work presents a comprehensive experimental study on the effect of glass frit thickness on the residual stress after laser bonding. The shear force and thermal residual stress of the bonding area due to laser bonding at different thicknesses of glass frit was investigated via experiment, respectively. Two method of ANSYS simulation and stress measurement were carried out. The result shows that the thinner the glass frit, the less residual stress of the after bonding sample; the shear force would increase with the thinning of the glass frit under the sufficient adhesion between the glass frit and the glass substrate. Thereby, an appropriate and sufficiently thin glass frit layer is recommended during the glass/glass laser bonding.
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