Gettering of iron by aluminum oxide thin films on silicon wafers: Kinetics and mechanisms

Metallic impurities in the silicon wafer bulk are one of the major efficiency-limiting factors in silicon solar cells. Gettering can be used to significantly lower the bulk metal concentrations. Aluminum oxide thin films from plasma-enhanced atomic layer deposition (PE-ALD) have been reported to getter iron from silicon wafers. However, its gettering mechanism and kinetics remain unclear. In this study, by experimentally monitoring the kinetics of iron reduction in the silicon wafer bulk, aluminum oxide gettering of iron is shown to be caused by a segregation mechanism. Fitting the experimental iron reduction kinetics by the simulation of a segregation gettering process based on various diffusion scenarios suggests that the gettering kinetics is limited by both the diffusivities of iron in the silicon wafer bulk and in the aluminum oxide film. The activation energy of the segregation gettering process (negative meaning exothermic reaction) is estimated to be −0.47 ± 0.16 eV for the investigated as-deposited PE-ALD aluminum oxide film at 550–900 °C, and −0.35 ± 0.06 eV at 400–900 °C for the same film after a 400 °C forming gas anneal (FGA), i.e., after activating the passivation effect of the film. Capacitance–voltage measurements of the films indicate a higher surface defect density in the as-deposited films as compared to the FGA-activated films, which suggests a possible correlation between the surface defect density and gettering.