Study on Cofired Multiplayer AlN Substrates for MCMs

The multilayer AlN substrates of high thermal conductivity were obtained by optimizing the ceramic composition, binder-burning process and the technology for cofiring the AlN casting green tape with W at high temperature. Of the substrates, the thermal conductivity is 190 W/(mK), the thermal expansion coefficient (from room temperature to 400℃) 4.6×10-6℃-1, the conductive layer number nine, sheet resistance of W conductor 9.8 mW, the substrate camber 0.01 mm/50mm The AlN multilayer ceramic substrates meet the power MCM requirements.