Effect of Temperature and Humidity on Degradation Behavior of Cu/Epoxy Interface under High Temperature and High Humidity Aging

This article reports on the degradation behavior of adhesion strength of the resin/copper interface under aging in high temperature and high humidity environment. The adhesion strength of a Cu joint with resin was investigated by a tensile test. The fracture surface was analyzed by Fourier transform infrared spectroscopy to investigate the degradation mechanism. As a result, it was found that the degradation of the adhesion strength is mainly caused by water absorption and subsequent volume expansion of the resin, and embrittlement of hydrogen bonding in the joint interface. Evaluation of deterioration life of the joint revealed that the relationships between the deterioration life and the temperature and humidity are confirmed above the glass transition temperature.