The effect of modified carbon black and nano-silica, individually and in combination, on the curing, mechanical, and dynamical properties of butyl rubber (IIR)

炭黑 固化(化学) 天然橡胶 材料科学 复合材料 纳米- 丁基橡胶
作者
Farzaneh Jaberi Mofrad,Ali Ahmadpour,Saeed Ostad Movahed
出处
期刊:Polymers & Polymer Composites [SAGE]
卷期号:32 被引量:1
标识
DOI:10.1177/09673911241256553
摘要

This study evaluates the effectiveness of a developed surface-modified carbon black, both alone and combined with nano-silica, as a hybrid filler for butyl rubber (IIR) compounds. The modification process, followed by coupling agent treatment, influenced crucial curing properties, including torque, cross-link density, viscosity, stiffness, and curing time. Scanning electron microscopy (SEM) analysis revealed improved filler dispersion and enhanced filler-rubber compatibility due to surface modification. The ∆Torque for compounds containing modified carbon black surpassed others by 13%. Mechanical properties such as tensile strength, elongation at break, modulus, tearing strength, and hardness were significantly influenced by filler type and surface modification. The harness (Shore A) increased to the value of 45 after surface amendment. Dynamic mechanical analysis (DMA) provided insights into storage modulus, loss modulus, and tan δ, showing the impact of filler type and surface modification. The utilization of coupling agent-modified carbon black decreased [Formula: see text] from −24°C to −30°C. Thermal gravimetric analysis (TGA) indicated consistent thermal stability across compounds, while solvent resistance improved with surface modification, as evidenced by swelling ratios. The thermodynamic analysis underscored the importance of filler type and surface modification on compound elasticity and flexibility. Overall, precise selection and optimization of filler materials and surface modifications are crucial for tailoring rubber compound properties to meet specific performance requirements across applications, impacting various aspects including curing, mechanical, dynamic, thermal, solvent resistance, and thermodynamic parameters.
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